100% brand new and high quality. These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use. High success rate of planting tin, the solder balls can be formed once when you are proficient. Simple and convenient to use.
Only the above package content, other products are not included. Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
Specifications
Key Features
BGA Stencil
Specifications
SKU: GE779IP4NV5CWNAFAMZ
Weight (kg): 0.07
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