4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

GH₵ 98.84

GH₵ 197.6850%

3 units left

Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 6.92 to Tema

4.5 out of 5

(4 verified ratings)

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Pickup Station

Delivery Fees GH₵ 16.44

Ready for pickup between 13 January and 16 January if you place your order within the next 7hrs 5mins

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Delivery Fees GH₵ 28.34

Ready for delivery between 13 January and 16 January if you place your order within the next 7hrs 5mins

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Delivery Fees GH₵ 6.92

Ready for delivery between 30 January and 13 February if you place your order within the next 7hrs 5mins

Return Policy

Free return within 15 days for all eligible items.Details

Seller Information

flowerrain

80%Seller Score

29 Followers

Seller Performance

Shipping speed: Average

Quality Score: Excellent

Customer Rating: Average

Product details

100% brand new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.