Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

GH₵ 143.63

GH₵ 206.6630%

In stock

Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 19.57 to Tema

0 out of 5

(No ratings available)

Variation available

ONE SIZE FITS ALL

Promotions

Enjoy cheaper delivery fees when you select a pickup station at checkout Free Delivery in Accra and Kumasi for Orders above GHC120. Pick-up stations only! (Excluding Large)

Report incorrect product information

Delivery & Returns

Shipped from abroad

Choose your location

Pickup Station

Delivery Fees GH₵ 19.57

Ready for pickup between 16 January and 21 January if you place your order within the next 11hrs 18mins

Door Delivery

Delivery Fees GH₵ 31.47

Ready for delivery between 16 January and 21 January if you place your order within the next 11hrs 18mins

Return Policy

Free return within 15 days for all eligible items.Details

Seller Information

Jinan Xirun Road Transport Co., Ltd

60%Seller Score

Be the first to follow

Seller Performance

This seller does not have enough history for us to evaluate his performance yet

Product details

Model Number: CPU BGA Reballing Stencil
Applicaiton:for Android Phone Repair
Thickness:0.12MM

Material:steel
colour:silver

Package Contents:
1 * BGA Stencil

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.