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Borlai
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New Model Universal BGA Reballing Stencil For Mobile Phone MTK MSM Samsung V80 Spreadtrum OV camera, ad CPU RAM PM Power IC Direct Heat Template
1. 55 Models New Universal Stencils2. 80 Models Stencil Suitable For V80 (New) ,Spreadtrum, OV camera, IC, MTK Series3. Precision mobile phone Universal Stencils (New)4. 0.3-1.24 Universal Stencil
Descrtion:
100% brand new and high quality.Feature:These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.Soe the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.High succe rate of planting tin, the solder balls can be formed once when you are proficient.Simple and convenient to use.
Note:
No retail package.Transition: 1cm=10mm=0.39inchPlease allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
1. 55 Models New Universal Stencil
2. 80 Models Stencil Suitable For V80 (New) ,Spreadtrum, OV camera, IC, MTK Serie
3. Precision mobile phone Universal Stencils (New)
4. 0.3-1.24 Universal Stencil
80 Models+ 55 Models:
All 4 PCS:
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