Mobile Phone Cooling Plate Heat Sink Expend Cooling Area for Cooling fans Game Cooler Cell Phone For IPhone/Samsung/Xiao

and high qualityFeature：[Mobile phone composite even heat plate] fast cooling uniform heat diipation, increase the heat diipation area, accelerate the speed of heat diipation.[Semiconductor cooling & large area heat sink] for cell phone using a large area even heat sink, rapid neulization of heat to achieve uniform heat diipation effect.[Strong adhesive - not fall off] strong adhesive, firmly adsorbed, no need to worry about radiator fall.[Thin and light experience] The thickne is only 1mm, closely fit the phone.[With silicone for protection, do not hurt the phone] easy to take and easy to paste, with silicone for protection, soft and do not hurt the machine.Product Specifications.Product name: Composite uniform heat plateProduct category: ordinary models (with semiconductor cooling back clip use, back material conductive silicon paper)ic (universal ic models and back clip models heat sink use, the back of the material double-sided adhesive)How to use: Attach to the back of the phone, with the use of heat sink, increase the heat diipation area, to achieve the phone CPU and camera cooling.The ic absorbing product is embedded inside the ic sheet, seamlely pasted, the ic absorbing radiator can be directly adsorbed to use.Package Included:1×Heat sink area increase plateNote:1.No retail package.2.Please allow 0-1cm error due to manual measurement. plz e sure you do not mind before you bid.3.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!