HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsPower Tool Parts & AccessoriesWoodworking Project Plans & KitsWoodworking Project KitsMJ IPH-16 BGA Reballing Stencil For X/XS/XS MAX/11/11 PRO MAX/12/12PRO MAX MINI IC Chip Tin Planting Soldering Net-IPH-16_Red
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MJ IPH-16 BGA Reballing Stencil For X/XS/XS MAX/11/11 PRO MAX/12/12PRO MAX MINI IC Chip Tin Planting Soldering Net-IPH-16_Red

GH₵ 236.29
GH₵ 319.4926%

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Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 26.06 to Tema
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Delivery Fees GH₵ 26.06
Ready for pickup between 10 January and 15 January if you place your order within the next 5hrs 40mins

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Delivery Fees GH₵ 37.96
Ready for delivery between 10 January and 15 January if you place your order within the next 5hrs 40mins

Return Policy

Free return within 15 days for all eligible items.Details

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Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: Case
  • Model Number: MJ BGA Reballing Stencil
  • Size: MJ iPH-16 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL
  • Application: For Phone Repairing
  • Item: High Qulaity BGA Reballing Stencil
  • Function: For Screen IC Face ID Dot Projector True Tone USB Charging IC Repair
  • Applicable Model: For X-12 PRO MAX
  • Thickness: 0.12mm
  • Feature 1: Ultra-thin Planting Tin net
  • Feature 2: BGA Reballing Stencil
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Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: Case
  • Model Number: MJ BGA Reballing Stencil
  • Size: MJ iPH-16 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL
  • Application: For Phone Repairing
  • Item: High Qulaity BGA Reballing Stencil
  • Function: For Screen IC Face ID Dot Projector True Tone USB Charging IC Repair
  • Applicable Model: For X-12 PRO MAX
  • Thickness: 0.12mm
  • Feature 1: Ultra-thin Planting Tin net
  • Feature 2: BGA Reballing Stencil

Specifications

  • SKU: GE779IP3RPLC6NAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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MJ IPH-16 BGA Reballing Stencil For X/XS/XS MAX/11/11 PRO MAX/12/12PRO MAX MINI IC Chip Tin Planting Soldering Net-IPH-16_Red

MJ IPH-16 BGA Reballing Stencil For X/XS/XS MAX/11/11 PRO MAX/12/12PRO MAX MINI IC Chip Tin Planting Soldering Net-IPH-16_Red

GH₵ 236.29
GH₵ 319.4926%
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