Home Home & Office Tools & Home Improvement Power & Hand Tools Power Tool Parts & Accessories Woodworking Project Plans & Kits Woodworking Project KitsMijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD

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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD

GH₵ 624.00

GH₵ 841.9826%

In stock

Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 53.20 to Tema

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Z21 MAX for iPhone_GOLD

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Pickup Station

Delivery Fees GH₵ 53.20

Ready for pickup between 13 December & 18 December when you order within next 3hrs 23mins

Door Delivery

Delivery Fees GH₵ 65.10

Ready for delivery between 13 December & 18 December when you order within next 3hrs 23mins

Return Policy

Free return within 15 days for all eligible items.Details

Seller Information

African Safari Treasures

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Shipping speed: Very Poor

Quality Score: Excellent

Customer Rating: Good

Product details

Welcome to our srore.
Type:Wrist Strap
Durable Material
Stylish Design
Versatile Usage
Great Value
Type: Combination
Application: Computer Tool Kit
Package: Case
Model Number: Mijing Z21 MAX
Size: 55*55*15mm
is_customized: YES
DIY Supplies: ELECTRICAL
Use: Chip tin planting suit
Item: Z21 MAX Chip Tin Station
Function: CPU BGA Reballing
Function 2: BGA Tin Planting
100%: ,

Specifications

Key Features

Welcome to our srore.
Type:Wrist Strap
Durable Material
Stylish Design
Versatile Usage
Great Value
Type: Combination
Application: Computer Tool Kit
Package: Case
Model Number: Mijing Z21 MAX
Size: 55*55*15mm
is_customized: YES
DIY Supplies: ELECTRICAL
Use: Chip tin planting suit
Item: Z21 MAX Chip Tin Station
Function: CPU BGA Reballing
Function 2: BGA Tin Planting
100%: ,

Specifications

SKU: GE779IP3YDFLINAFAMZ
Production Country: China
Weight (kg): 0.5
Warranty Type: Repair by Vendor

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