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HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsPower Tool Parts & AccessoriesWoodworking Project Plans & KitsWoodworking Project KitsMIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils-Z21 MAX for Android_WHITE
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MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils-Z21 MAX for Android_WHITE
GH₵ 780.42
GH₵ 1,053.3126%
In stock
Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 64.15 to Tema
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Pickup Station
Delivery Fees GH₵ 64.15
Ready for pickup between 08 January and 13 January if you place your order within the next 15hrs 16mins
Door Delivery
Delivery Fees GH₵ 76.05
Ready for delivery between 08 January and 13 January if you place your order within the next 15hrs 16mins
Return Policy
Free return within 15 days for all eligible items.Details
Seller Information
African Safari Treasures
44%Seller Score
2 Followers
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Shipping speed: Poor
Product details
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- is_customized: No
- Type: Combination
- Application: Mobile Phone Repair
- Model Number: MIJING Z21 MAX chip tin station
- Package: Case
- Certification: CE
- DIY Supplies: ELECTRICAL
- Item name: Mobile Phone CPU reballing stencil platform
- Type: MIJING BGA Reballing Stencil
- Support 1: for 11 12 12 pro 13 mini 13 pro max
- Support 2: for 14/14 Plus/14Pro/14 Pro Max
- Support 4: for 15 15plus 15pro 15promax
- Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
- Features: Double magnet, super magnetic, accurate positioning
- Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
- Usage: Motherboard Reballing Soldering Platform
Specifications
Key Features
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- is_customized: No
- Type: Combination
- Application: Mobile Phone Repair
- Model Number: MIJING Z21 MAX chip tin station
- Package: Case
- Certification: CE
- DIY Supplies: ELECTRICAL
- Item name: Mobile Phone CPU reballing stencil platform
- Type: MIJING BGA Reballing Stencil
- Support 1: for 11 12 12 pro 13 mini 13 pro max
- Support 2: for 14/14 Plus/14Pro/14 Pro Max
- Support 4: for 15 15plus 15pro 15promax
- Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
- Features: Double magnet, super magnetic, accurate positioning
- Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
- Usage: Motherboard Reballing Soldering Platform
Specifications
- SKU: GE779IP3IFG0MNAFAMZ
- Production Country: China
- Weight (kg): 0.5
- Warranty Type: Repair by Vendor
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/product/12/3522142/1.jpg?6009)
MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils-Z21 MAX for Android_WHITE
GH₵ 780.42
GH₵ 1,053.3126%
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