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MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils

GH₵ 797.30
GH₵ 1,076.1026%

In stock

Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 65.33 to Tema
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Enjoy cheaper delivery fees when you select a pickup station at checkoutFree Delivery in Accra and Kumasi for Orders above GHC120. Pick-up stations only! (Excluding Large)
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Pickup Station

Delivery Fees GH₵ 65.33
Ready for pickup between 21 January and 24 January if you place your order within the next 18hrs 1mins

Door Delivery

Delivery Fees GH₵ 77.23
Ready for delivery between 21 January and 24 January if you place your order within the next 18hrs 1mins

Return Policy

Free return within 15 days for all eligible items.Details

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Shipping speed: Very Poor

Quality Score: Excellent

Customer Rating: Poor

Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • is_customized: No
  • Type: Combination
  • Application: Mobile Phone Repair
  • Model Number: MIJING Z21 MAX chip tin station
  • Package: Case
  • Certification: CE
  • DIY Supplies: ELECTRICAL
  • Item name: Mobile Phone CPU reballing stencil platform
  • Type: MIJING BGA Reballing Stencil
  • Support 1: for 11 12 12 pro 13 mini 13 pro max
  • Support 2: for 14/14 Plus/14Pro/14 Pro Max
  • Support 4: for 15 15plus 15pro 15promax
  • Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
  • Features: Double magnet, super magnetic, accurate positioning
  • Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
  • Usage: Motherboard Reballing Soldering Platform
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Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • is_customized: No
  • Type: Combination
  • Application: Mobile Phone Repair
  • Model Number: MIJING Z21 MAX chip tin station
  • Package: Case
  • Certification: CE
  • DIY Supplies: ELECTRICAL
  • Item name: Mobile Phone CPU reballing stencil platform
  • Type: MIJING BGA Reballing Stencil
  • Support 1: for 11 12 12 pro 13 mini 13 pro max
  • Support 2: for 14/14 Plus/14Pro/14 Pro Max
  • Support 4: for 15 15plus 15pro 15promax
  • Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
  • Features: Double magnet, super magnetic, accurate positioning
  • Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
  • Usage: Motherboard Reballing Soldering Platform

Specifications

  • SKU: GE779IP4UJRP5NAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils

MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils

GH₵ 797.30
GH₵ 1,076.1026%
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