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HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsPower Tool Parts & AccessoriesWoodworking Project Plans & KitsWoodworking Project KitsMIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils
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MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils
GH₵ 600.10
GH₵ 810.9026%
In stock
Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 51.53 to Tema
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Delivery Fees GH₵ 51.53
Ready for pickup between 13 December & 18 December when you order within next 2hrs 44mins
Door Delivery
Delivery Fees GH₵ 63.43
Ready for delivery between 13 December & 18 December when you order within next 2hrs 44mins
Return Policy
Free return within 15 days for all eligible items.Details
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Shipping speed: Poor
Quality Score: Excellent
Product details
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- is_customized: No
- Type: Combination
- Application: Mobile Phone Repair
- Model Number: MIJING Z21 MAX chip tin station
- Package: Case
- Certification: CE
- DIY Supplies: ELECTRICAL
- Item name: Mobile Phone CPU reballing stencil platform
- Type: MIJING BGA Reballing Stencil
- Support 1: for 11 12 12 pro 13 mini 13 pro max
- Support 2: for 14/14 Plus/14Pro/14 Pro Max
- Support 4: for 15 15plus 15pro 15promax
- Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
- Features: Double magnet, super magnetic, accurate positioning
- Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
- Usage: Motherboard Reballing Soldering Platform
Specifications
Key Features
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- is_customized: No
- Type: Combination
- Application: Mobile Phone Repair
- Model Number: MIJING Z21 MAX chip tin station
- Package: Case
- Certification: CE
- DIY Supplies: ELECTRICAL
- Item name: Mobile Phone CPU reballing stencil platform
- Type: MIJING BGA Reballing Stencil
- Support 1: for 11 12 12 pro 13 mini 13 pro max
- Support 2: for 14/14 Plus/14Pro/14 Pro Max
- Support 4: for 15 15plus 15pro 15promax
- Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
- Features: Double magnet, super magnetic, accurate positioning
- Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
- Usage: Motherboard Reballing Soldering Platform
Specifications
- SKU: GE779IP3GIPQHNAFAMZ
- Production Country: China
- Weight (kg): 0.5
- Warranty Type: Repair by Vendor
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/product/09/1455452/1.jpg?2852)
MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils
GH₵ 600.10
GH₵ 810.9026%
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