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MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils

GH₵ 600.10
GH₵ 810.9026%

In stock

Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 51.53 to Tema
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Enjoy cheaper delivery fees when you select a pickup station at checkoutFree Delivery in Accra and Kumasi for Orders above GHC120. Pick-up stations only! (Excluding Large)
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Pickup Station

Delivery Fees GH₵ 51.53
Ready for pickup between 21 January and 24 January if you place your order within the next 17hrs 23mins

Door Delivery

Delivery Fees GH₵ 63.43
Ready for delivery between 21 January and 24 January if you place your order within the next 17hrs 23mins

Return Policy

Free return within 15 days for all eligible items.Details

Seller Information

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Shipping speed: Very Poor

Quality Score: Excellent

Customer Rating: Poor

Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • is_customized: No
  • Type: Combination
  • Application: Mobile Phone Repair
  • Model Number: MIJING Z21 MAX chip tin station
  • Package: Case
  • Certification: CE
  • DIY Supplies: ELECTRICAL
  • Item name: Mobile Phone CPU reballing stencil platform
  • Type: MIJING BGA Reballing Stencil
  • Support 1: for 11 12 12 pro 13 mini 13 pro max
  • Support 2: for 14/14 Plus/14Pro/14 Pro Max
  • Support 4: for 15 15plus 15pro 15promax
  • Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
  • Features: Double magnet, super magnetic, accurate positioning
  • Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
  • Usage: Motherboard Reballing Soldering Platform
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Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • is_customized: No
  • Type: Combination
  • Application: Mobile Phone Repair
  • Model Number: MIJING Z21 MAX chip tin station
  • Package: Case
  • Certification: CE
  • DIY Supplies: ELECTRICAL
  • Item name: Mobile Phone CPU reballing stencil platform
  • Type: MIJING BGA Reballing Stencil
  • Support 1: for 11 12 12 pro 13 mini 13 pro max
  • Support 2: for 14/14 Plus/14Pro/14 Pro Max
  • Support 4: for 15 15plus 15pro 15promax
  • Support 3: For /HiSilicon /Qualcomm /Snapdragon/ Kirin /EMMC/EMCP/UFS BGA153
  • Features: Double magnet, super magnetic, accurate positioning
  • Function: for 6-X XS XSMAX CPU repair,CPU IC tin planting
  • Usage: Motherboard Reballing Soldering Platform

Specifications

  • SKU: GE779IP3GIPQHNAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils

MIJING Z21 MAX Chip Tin Planting Table For 6-15promax Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils

GH₵ 600.10
GH₵ 810.9026%
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