HomeHome & OfficeTools & Home ImprovementElectricalHome Automation DevicesModulesMCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
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MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

GH₵ 269.00
GH₵ 384.0030%

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Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 18.83 to Tema
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Delivery Fees GH₵ 35.49
Ready for pickup between 13 January and 16 January if you place your order within the next 2hrs 33mins

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Delivery Fees GH₵ 47.39
Ready for delivery between 13 January and 16 January if you place your order within the next 2hrs 33mins

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Delivery Fees GH₵ 18.83
Ready for delivery between 30 January and 13 February if you place your order within the next 2hrs 33mins

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Free return within 15 days for all eligible items.Details

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Product details

MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

1. Type: Test Block
2. Working frequency: High frequency
3. Application: Integrated Circuit IC
4. Contact impedance: Less than 25 milliohms
5. Production process: Injection molding
6. Features: Fire retardant/flame retardant
7. Contact material: Beryllium copper shrapnel
8. Insulator material: PEI, PPS
9. Number of cores: 20
10. Working temperature: -65~155 degrees Celsius
11. Lead spacing: 0.65mm
12. Service life: 20,000 times
13. Adaptation chip body width: 4.4mm
Features:
1. Using double contact technology, the contact is more stable
2. The seat shell is made of special engineering plastic, which has high strength and long life.
3. The shrapnel adopts imported beryllium copper material, which has low impedance and good elasticity
4. Thick gold plating layer, thick contact plating, ultra-low contact impedance, high reliability


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Specifications

Key Features

  • MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

What’s in the box

1 x package

Specifications

  • SKU: GE779IP3U82L3NAFAMZ
  • Model: B18912R8U=TBD05546855
  • Production Country: China
  • Size (L x W x H cm): 15 x 12 x 6cm
  • Weight (kg): 0.18
  • Color: Multicolor
  • Main Material: Multi-Material

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MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

MCU Tools SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

GH₵ 269.00
GH₵ 384.0030%
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