Home Phones & Tablets Cell Phone Accessories Replacement Parts & ToolsJP-19 Thermostatic Soldering Platform For IPhone X / XS / XS Max Motherboard Layering Upper Lower Separation Glue Remove, US Plug

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JP-19 Thermostatic Soldering Platform For IPhone X / XS / XS Max Motherboard Layering Upper Lower Separation Glue Remove, US Plug

GH₵ 756.00

GH₵ 1,511.0050%

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Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 52.92 to Tema

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Delivery Fees GH₵ 62.44

Ready for pickup between 10 February and 13 February if you place your order within the next 21hrs 15mins

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Hickey Mall

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Product details

1. Support 110V/220V two kinds of voltage, the temperature is 200 degree centigrade.

2. Constant high temperature, porous heat dissipation, one-key separation.

3. Double step positioning, safe disassembly, detachable and weldable.

4. Positioning degumming tank, all kinds of chips easy degumming.

5. Silica gel is completely surrounded, anti-slip and heat-resistant to prevent current leakage.

6. High purity copper plate, extension design, professional welding tools.

7. High precision CNC machining, heat evenly without damage to the motherboard.

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