IC Repair BGA Rework Reballing Stencil Template Thin For IPhone 66

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Description:

Multi-purpose phone BGA stencil template.
High precision and not easily deformed High Quality BGA stencil template for phone BGA chips.
Each type BGA reballing stencil template support a variety of BGA IC.
Used for motherboard CPU / audio / power IC / USB control IC or BGA IC repair.
Compatible with iPhone 6/6 Plus.

IC Repair BGA Rework Reballing Stencil Template for iPhone 6/6 Plus

Specification:

Material: Metal
Size: Approx. 11.5*9*0.1 cm/4.53*3.54*0.04 inch

Package Includes:

1 Piece BGA Reballing Stencil

IC Repair Stencil;BGA Reballing Template;BGA Stencil;BGA Reballing Stencil;Reballing Repair Tool;BGA Rework Reballing Stencil

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