EMMC3 BGA Reballing Stencil Template For Android EMMC EMCP UFS UMCP LPDDR NAND

For Android EMMC EMCP UFS UMCP LPDDR NAND PCIE

BGA162 BGA153 BGA169 BGA221 BGA186 BGA297 BGA254 BGA178 BGA200 BGA110 BGA60 BGA70

About shping
Shping and Packaging All it will be double checked and well packed before sending.It will be dispatched within 2 business days after buyers pay for the order. It usually takes about 14 to 18 working days for delivering the package to the destination(for e areas,it may take a little longer). 

Special Announcement:
Please fill in the correct and detailed consignee, address and phone number in the order. For fast and correct delivery.If you do not receive order within 30 working days,please feel free to contact Customer Service before leaving Negative and Neutral Feedback, we will do our best to help you resoe the problem.TaxNo, you will only pay what is quoted as total cost at checkout, no more. You are not expected to pay any additional duties or taxes. If you are asked by Customs or our logistic partner to pay duties, please contact our Customer Service .

Your 100% satisfaction is very ant to us
If the product is not on good condition, You can return this product within 14 working days, please contact customer service center before returning.FeedbackYour satisfaction is our first priorityIf you receive the order and it is in good condition,we would be grateful if you would leave us 5 star Positive Feedback for the transaction.