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BGA Reballing Stencil for Qualcomm Snapdragon 835/820 MSM8998 MSM8996 Direct heating BGA Template

GH₵ 244.80

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Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 26.66 to Tema
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Delivery Fees GH₵ 26.66
Ready for pickup between 11 October & 16 October when you order within next 27mins

Door Delivery

Delivery Fees GH₵ 38.56
Ready for delivery between 11 October & 16 October when you order within next 27mins

Return Policy

Free return within 15 days for all eligible items.Details

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Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: BAG
  • Model Number: BGA Stencil for Qualcomm Snapdragon
  • Size: thickness 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL
image

Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: BAG
  • Model Number: BGA Stencil for Qualcomm Snapdragon
  • Size: thickness 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL

Specifications

  • SKU: GE779IP4B884FNAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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BGA Reballing Stencil for Qualcomm Snapdragon 835/820 MSM8998 MSM8996 Direct heating BGA Template

BGA Reballing Stencil for Qualcomm Snapdragon 835/820 MSM8998 MSM8996 Direct heating BGA Template

GH₵ 244.80
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