Home Phones & Tablets Cell Phone Accessories Replacement PartsA13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For IPhone 11 11 Pro 11 Pro Max

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A13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For IPhone 11 11 Pro 11 Pro Max

GH₵ 1,013.06

GH₵ 2,017.7450%

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Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 80.43 to Tema

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Delivery Fees GH₵ 80.43

Ready for pickup between 20 December and 27 December if you place your order within the next 7hrs 45mins

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Delivery Fees GH₵ 92.33

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haixia

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Product details

1. Professional tool for mobile phones repairing.

2. Suitable for iPhone 11 / 11 Pro / 11 Pro Max.

3. The unique holes design makes it easier to take out the formed solder balls.

4. This stencil is easy to use no matter you are a new or expert.

5. Special design enables stencil to align with tinning position of CPU rapidly.

6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.

7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.

8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.

9. Special steel manufacturing, high temperature resistance, no deformation.

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