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HomeMiscellaneous4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
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Shipped from abroad
4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
GH₵ 277.50
GH₵ 433.9236%
In stock
Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 56.32 to Tema
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Shipped from abroad
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Pickup Station
Delivery Fees GH₵ 56.32
Ready for pickup between 19 July & 24 July when you order within next 21hrs 40mins
Door Delivery
Delivery Fees GH₵ 83.69
Ready for delivery between 19 July & 24 July when you order within next 21hrs 40mins
Return Policy
Free return within 15 days for all eligible items.Details
Seller Information
Radisson
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Product details
100% brand new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
Specifications
Key Features
BGA Stencil
Specifications
- SKU: GE779HA1R1US5NAFAMZ
- Weight (kg): 0.07
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/product/05/9023571/1.jpg?1364)
4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
GH₵ 277.50
GH₵ 433.9236%
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