3D Printer Heated Bed Power Module High Current 210A MOSFET upgrade RAMPS 1.4,Default NO

Features:

Style 1:

Heated bed power module

Based on powerful MOSFET HA210NO6

Size: 60*50mm

Mounting holes: 3.2mm diameter, for M3 screws.

Distance betweeen holes: 54*43mm

Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle

Voltage: 12V-24V

Maximum current with active cooling: 210A

Style 2:

Size: 70*45mm

Mounting holes: 3.2mm diameter, for M3 screws.

Distance betweeen holes: 62.8*37.8mm

Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle

Voltage: 12V-50V

Maximum current with active cooling: 210A

This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)

Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working

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