3D BGA Stencil A8 A9 A10 A11 A12 A13 A14 For iPhone 6 6P 6S

3D BGA Stencil A8 A9 A10 A11 A12 A13 A14 For iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XR/XS/11/11Pro/MAX IC Solder Reball Tin Plant Net

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Our shop sells the most popular 3C consumer electronics products,such as mobile phone accessories,computer accessories,game peripherals,smart wearables,and follow the most popular fashion trends. If you like our products,please follow us,become our follower and fan.We will provide you with the most popular products to satisfy your fashion shopping experience.is_customized : NoPackage : CaseModel Number : mijing BGA Reballing StencilsApplication : Computer Tool KitDIY Supplies : ELECTRICALType : CombinationBrand Name : MILEOrigin : Mainland ChinaApplication: : CPU BGA ReballingNumber of Pieces: : 1 pieceCombination: : For iPhone 6 6P 6S 6SP 7 7 8 8P X XS XR XS-Max 11proMAX HIgh Quality 3D IC BGA Reballing Stencil,Can location the IC when you repair, it's so convenient. Stable, and accurately. Don't need IC holder station  Feature: 1.Stepped groove design enables stencil to align with tinning position of IC rapidly. 2.The square holes design makes it easier to take out the formed solder balls. 3.This 3D stencil is easy to use no matter you are a new or expert. 4.High success rate of planting tin,the solder balls can be formed once after you are proficient. 5.This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer. Some new products have blue protect film,Please remove it before you use it Number of Pieces:1 piece