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HomeIndustrial & ScientificIndustrial ElectricalSemiconductor ProductsInterfacesCommunication Integrated CircuitsBga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate
product_image_name-Generic-Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate-1product_image_name-Generic-Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate-2product_image_name-Generic-Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate-3product_image_name-Generic-Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate-4product_image_name-Generic-Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate-5product_image_name-Generic-Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate-6

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Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate

GH₵ 720.21
GH₵ 1,224.3941%

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Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 67.07 to Tema
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Delivery Fees GH₵ 67.07
Ready for pickup between 13 January and 16 January if you place your order within the next 2hrs 10mins

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Delivery Fees GH₵ 78.97
Ready for delivery between 13 January and 16 January if you place your order within the next 2hrs 10mins

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Free return within 15 days for all eligible items.Details

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Oblgs Lww

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GH₵ 732.68

Sold by: Eldwin Emrick | Seller Score: 60%

Product details

  • Condition:New
  • Type:Voltage regulator
  • Application:Mobile phone
image image image image image image

Specifications

Key Features

  • Condition:New
  • Type:Voltage regulator
  • Application:Mobile phone

What’s in the box

1*Integrated circuit

Specifications

  • SKU: GE779IP4FN44ZNAFAMZ
  • Model: Integrated circuit 2024
  • Production Country: China
  • Size (L x W x H cm): N/A
  • Weight (kg): 1
  • Color: 4pcs for each
  • Main Material: Plastic
  • From the Manufacturer: Prohibit high temperature exposure
  • Warranty Address: N/A
  • Warranty Type: Repair by Vendor

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Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate

Bga Stencil Soldering For Ipad 6/air2/5/air/4/3/2/mini/pro 12.9/10.5/9.7 Ic Chip Power U2 Nand Pcie Tin Template Reballing Plate

GH₵ 720.21
GH₵ 1,224.3941%
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